Apple A17 may use 3nm process: TSMC OEM

On October 10th, according to 9TO5MAC, Apple launched the iPhone 15 series in the second half of next year. The top version is equipped with Apple A17 bionic chip. This chip uses a 3nm process and is founded by TSMC.

The report pointed out that the only thing that can compete with TSMC in advanced technology at present is Samsung Electronics. However, Samsung has started TSMC in the 3nm process. Samsung's second -generation 3nm process will be as soon as 2024. Therefore, the Apple A17 will be founded by TSMC.

It is reported that 3nm is currently the most advanced process of TSMC. Compared with 5nm, the chip density based on the N3E process is 1.3 times, and the density of logic door increases by 1.6 times. The power consumption is reduced by 30-35%.

The innovation of the 3nm series is mainly due to its use of FINFLEX technology, which can maintain the balance of speed and power consumption while increasing density. Related logic test chips and 3mm 256MB SRAM (static random access memory) have a yield of about 80%. It is estimated that the initial yield will be better than the early stage of the 5nm N5 process.

It is worth noting that Samsung's goal is to catch up with TSMC in 2025, and the overtaking in 2027. It is rumored that Samsung will produce 2nm in 2025 and 1.4nm in 2027. At the same time, he hopes to get Apple orders.