MediaTek Dimensity 1050 release: Avoid the Cortex-A710 for the first time with 5G full band support

On the morning of May 23, MediaTek announced the launch of Its first mobile processor supporting 5G millimeter wave band, Dimensity 1050, which is expected to be released in the third quarter. Dimensity 1050 uses A 6nm PROCESS from TSMC, eschewing the ARM V9's Corcor-A710 CPU architecture and opting for a more practical dual-core A78 plus a six-core A55 with a maximum frequency of 2.5ghz. The GPU is integrated with the Mali G610.

In terms of communication, it supports 5G dual-card dual-standby and dual-card VoNR, sub-6ghz band supports 3CC tri-carrier aggregation, and millimeter wave high band supports quad-carrier aggregation.

Other basic parameters, support LPDDR5 and UFS 3.1 storage combination, support the maximum FHD+ 144Hz screen display, support up to 100 million pixel main camera, support Wi-Fi 6E 2X2 MIMO and so on.

Media reports suggest that The Dimensity 1050 May be launched to open up markets such as North America, where the millimeter-wave spectrum is the mainstream for 5G deployment.

Mediatek also updated two 4G chips, Dimensity 930 and Helio G99.